1. Corrosion Resistance: Copper leh iron ang chi raw material te hi boruakah oxidation a awm duh hle. Oxidation resistance chak tak nei metal layer electroplating hian terminal-te corrosion resistance a tichak thei a ni.
2. Enhanced Conductivity: Raw materials iron leh phosphor bronze te hian conductivity 20% hnuai lam an nei tlangpui a, hei vang hian low-impedance n-type connector atan a tha lo hle. Chuvangin, rangkachak ang chi high-conductivity metal layer plating hian an impedance a tihziaawm thei a ni.
3. Plating Adhesion tihchangtlun: Metal adhesion tha lo tan chuan adhesion tihchangtlun nan electroplating hmain copper base coat an hnawih tlangpui.